NXP Semiconductors - LPC1317FBD64

LPC1317FBD64 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC1317FBD64
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet LPC1317FBD64 Datasheet
In Stock622
NAME DESCRIPTION
Minimum Supply Voltage: 2 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: TIN
ADC Channels: YES
No. of Terminals: 64
DMA Channels: NO
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
No. of I/O Lines: 51
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PQFP-G64
Maximum Clock Frequency: 25 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LFQFP
Width: 10 mm
Moisture Sensitivity Level (MSL): 3
Speed: 72 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
External Data Bus Width: 0
Bit Size: 32
DAC Channels: NO
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Length: 10 mm
PWM Channels: YES
On Chip Program ROM Width: 8
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
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