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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | LPC18S50FET256 |
| Description | Microcontrollers; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Width: 17 mm; |
| Datasheet | LPC18S50FET256 Datasheet |
| In Stock | 2,584 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.2 V |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| ADC Channels: | YES |
| No. of Terminals: | 256 |
| DMA Channels: | YES |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE |
| No. of I/O Lines: | 164 |
| Address Bus Width: | 24 |
| Maximum Clock Frequency: | 25 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | LBGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 180 rpm |
| Maximum Supply Voltage: | 3.6 V |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| JESD-609 Code: | e1 |
| Length: | 17 mm |
| PWM Channels: | YES |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1 mm |
