NXP Semiconductors - LPC2144FBD64-S

LPC2144FBD64-S by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC2144FBD64-S
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
Datasheet LPC2144FBD64-S Datasheet
In Stock1,273
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 90 mA
No. of Terminals: 64
Terminal Position: QUAD
Package Style (Meter): FLATPACK
JESD-30 Code: S-PQFP-G64
Package Shape: SQUARE
ROM Words: 131072
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Speed: 60 rpm
RAM Bytes: 16384
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP64,.47SQ,20
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
CPU Family: ARM7
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