NXP Semiconductors - LS1023AXE7MQB

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LS1023AXE7MQB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LS1023AXE7MQB
Description SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; Maximum Operating Temperature: 105 Cel;
Datasheet LS1023AXE7MQB Datasheet
In Stock2,696
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Maximum Time At Peak Reflow Temperature (s): 30
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Terminals: 621
Terminal Position: BOTTOM
Technology: CMOS
JESD-30 Code: S-PBGA-B621
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Peak Reflow Temperature (C): 250
Moisture Sensitivity Level (MSL): 3
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