NXP Semiconductors - LS1023AXE8PQB

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LS1023AXE8PQB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LS1023AXE8PQB
Description SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
Datasheet LS1023AXE8PQB Datasheet
In Stock707
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.07 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 780
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B780
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.03 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 23 mm
Additional Features: ALSO OPERATES AT 1V SUPPLY NOM
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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