NXP Semiconductors - MCIMX7D7DVM10SC

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MCIMX7D7DVM10SC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX7D7DVM10SC
Description SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX7D7DVM10SC Datasheet
In Stock1,347
NAME DESCRIPTION
Minimum Supply Voltage: 1.045 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.1 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.4 mm
Surface Mount: YES
No. of Terminals: 541
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B541
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 95 Cel
Package Code: LFBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.25 V
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA541,25X25,30
Length: 19 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .75 mm
Temperature Grade: OTHER
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