NXP Semiconductors - LS1023AXN7KQB

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LS1023AXN7KQB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LS1023AXN7KQB
Description MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
Datasheet LS1023AXN7KQB Datasheet
In Stock3,737
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .9 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.07 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 621
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B621
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: HFBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MULTIFUNCTION PERIPHERAL
Maximum Supply Voltage: .93 V
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA621,25X25,32
Length: 21 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
3,737 $60.220 $225,042.140

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