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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | LS1043AXN7MQLB |
Description | SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE; |
Datasheet | LS1043AXN7MQLB Datasheet |
In Stock | 223 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .87 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | SYSTEM ON CHIP |
Nominal Supply Voltage: | .9 V |
Maximum Supply Voltage: | .93 V |
Maximum Seated Height: | 2.07 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 621 |
Package Equivalence Code: | BGA621,25X25,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
Length: | 21 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B621 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | HFBGA |
Width: | 21 mm |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |