Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | LS1044AXE7PTA |
| Description | SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | LS1044AXE7PTA Datasheet |
| In Stock | 779 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .995 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SYSTEM ON CHIP |
| Nominal Supply Voltage: | 1.025 V |
| Maximum Supply Voltage: | 1.055 V |
| Maximum Seated Height: | 2.61 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 780 |
| Package Equivalence Code: | BGA780,28X28,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Length: | 23 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B780 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Peak Reflow Temperature (C): | 250 |
| Package Code: | FBGA |
| Width: | 23 mm |
| Terminal Pitch: | .8 mm |
| Moisture Sensitivity Level (MSL): | 3 |
