NXP Semiconductors - LX2160XN72232B

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LX2160XN72232B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LX2160XN72232B
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
Datasheet LX2160XN72232B Datasheet
In Stock16
NAME DESCRIPTION
Minimum Supply Voltage: .82 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.51 mm
Surface Mount: YES
Maximum Supply Current: .05 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 1517
No. of Serial I/Os: 17
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 36
Technology: CMOS
JESD-30 Code: S-PBGA-B1517
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Width: 40 mm
Moisture Sensitivity Level (MSL): 3
Speed: 2200 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: .88 V
No. of External Interrupts: 12
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 128
Bit Size: 64
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA1517.39X39,40
Length: 40 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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