NXP Semiconductors - MC13892DJVK

MC13892DJVK by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC13892DJVK
Description POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 139; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES;
In Stock683
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Width (mm): 7 mm
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.8 V
Maximum Supply Current (Isup): 1.5 mA
Sub-Category: Power Management Circuits
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER OVER NICKEL
No. of Terminals: 139
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
JESD-30 Code: S-PBGA-B139
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
No. of Channels: 1
Package Code: TFBGA
Nominal Supply Voltage (Vsup): 3.6 V
Moisture Sensitivity Level (MSL): 3
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA139,13X13,20
Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT
Length: 7 mm
Adjustable Threshold: YES
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
Power Supplies (V): 3.6
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