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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MC68SEC000AA20R2 |
Description | MICROPROCESSOR; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; |
Datasheet | MC68SEC000AA20R2 Datasheet |
In Stock | 3,266 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 5 V |
Integrated Cache: | NO |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 2.45 mm |
Surface Mount: | YES |
Terminal Finish: | TIN |
No. of Terminals: | 64 |
Terminal Position: | QUAD |
Format: | FIXED POINT |
Package Style (Meter): | FLATPACK |
Address Bus Width: | 24 |
Technology: | HCMOS |
JESD-30 Code: | S-PQFP-G64 |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Package Code: | QFP |
Width: | 14 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 20 rpm |
Peripheral IC Type: | MICROPROCESSOR |
Low Power Mode: | YES |
Boundary Scan: | NO |
External Data Bus Width: | 16 |
Bit Size: | 32 |
JESD-609 Code: | e3 |
Length: | 14 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |