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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC8640DTVU1067NE |
| Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE; |
| Datasheet | MC8640DTVU1067NE Datasheet |
| In Stock | 638 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .9 V |
| Package Body Material: | CERAMIC |
| Nominal Supply Voltage: | .95 V |
| Integrated Cache: | YES |
| Maximum Seated Height: | 2.77 mm |
| Surface Mount: | YES |
| No. of Terminals: | 1023 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| No. of DMA Channels: | 4 |
| Address Bus Width: | 32 |
| Technology: | CMOS |
| JESD-30 Code: | S-CBGA-B1023 |
| Maximum Clock Frequency: | 166.66 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | HBGA |
| Width: | 33 mm |
| Speed: | 1067 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1 V |
| Low Power Mode: | NO |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | BGA1023,32X32,40 |
| Length: | 33 mm |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |








