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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC92600JUB |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | MC92600JUB Datasheet |
| In Stock | 1,809 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.65 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.32 mm |
| Surface Mount: | YES |
| No. of Terminals: | 217 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B217 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Supply Voltage: | 1.95 V |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Length: | 23 mm |
| Peak Reflow Temperature (C): | 220 |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |









