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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MC92600JUB |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | MC92600JUB Datasheet |
In Stock | 1,809 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.65 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 2.32 mm |
Surface Mount: | YES |
No. of Terminals: | 217 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B217 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 23 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 1.95 V |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Length: | 23 mm |
Peak Reflow Temperature (C): | 220 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | COMMERCIAL |