NXP Semiconductors - MC9328MXLCVP15R2

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MC9328MXLCVP15R2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC9328MXLCVP15R2
Description SoC; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
Datasheet MC9328MXLCVP15R2 Datasheet
In Stock4,683
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Nominal Supply Voltage: 1.8 V
Maximum Supply Voltage: 1.9 V
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 225
Package Equivalence Code: BGA225,15X15,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Length: 13 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B225
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 13 mm
Terminal Pitch: .8 mm
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