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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC9328MXLVM20R2 |
| Description | SoC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel; |
| Datasheet | MC9328MXLVM20R2 Datasheet |
| In Stock | 3,049 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.7 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SoC |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Supply Voltage: | 1.9 V |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 256 |
| Package Equivalence Code: | BGA256,16X16,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 14 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LFBGA |
| Width: | 14 mm |
| Terminal Pitch: | .8 mm |








