NXP Semiconductors - MC9S08MM128CMB

MC9S08MM128CMB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC9S08MM128CMB
Description MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: BGA; Package Shape: SQUARE;
In Stock555
NAME DESCRIPTION
Minimum Supply Voltage: 2.4 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 24 mA
Terminal Finish: TIN SILVER COPPER
ADC Channels: YES
No. of Terminals: 81
DMA Channels: NO
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 33
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PBGA-B81
Maximum Clock Frequency: 24 MHz
Package Shape: SQUARE
ROM Words: 131072
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 10 mm
Moisture Sensitivity Level (MSL): 3
Speed: 48 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 3.6 V
RAM Bytes: 12288
External Data Bus Width: 0
Bit Size: 8
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA81,9X9,40
Length: 10 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/3.3
CPU Family: HCS08
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Pricing (USD)

Qty. Unit Price Ext. Price
555 $7.380 $4,095.900

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