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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MCF5235CVM150 |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; |
In Stock | 1,046 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.4 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.5 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.6 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER OVER NICKEL |
No. of Terminals: | 256 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
Address Bus Width: | 24 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B256 |
Maximum Clock Frequency: | 75 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LBGA |
Width: | 17 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 150 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.6 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Length: | 17 mm |
Additional Features: | LOW POWER MODE TAKEN FROM LOW POWER MODE |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |