NXP Semiconductors - MCF5474VR200

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MCF5474VR200 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCF5474VR200
Description MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA388,26X26,40;
In Stock144
NAME DESCRIPTION
Minimum Supply Voltage: 1.43 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.5 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.55 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
On Chip Data RAM Width: 8
No. of Terminals: 388
No. of Serial I/Os: 4
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
No. of DMA Channels: 16
Address Bus Width: 32
Technology: CMOS
RAM Words: 32768
JESD-30 Code: S-PBGA-B388
Maximum Clock Frequency: 66.67 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 1.58 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA388,26X26,40
Length: 27 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
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