NXP Semiconductors - MCIMX31DVMN5D

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MCIMX31DVMN5D by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX31DVMN5D
Description SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX31DVMN5D Datasheet
In Stock2,957
NAME DESCRIPTION
Minimum Supply Voltage: 1.52 V
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.54 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 473
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B473
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: LFBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.65 V
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA473,23X23,32
Length: 19 mm
Additional Features: UNAVAILABLE FOR IMPORT OR SALE IN US
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 1.2/1.5,1.8/3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
2,957 $38.860 $114,909.020

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