NXP Semiconductors - MCIMX31LDVMN5DR2

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MCIMX31LDVMN5DR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX31LDVMN5DR2
Description MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: FBGA; Package Shape: SQUARE;
In Stock2,087
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MULTIFUNCTION PERIPHERAL
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
No. of Terminals: 473
Qualification: Not Qualified
Package Equivalence Code: BGA473,23X23,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B473
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Peak Reflow Temperature (C): 260
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 1.2/1.5,1.8/3.3
Moisture Sensitivity Level (MSL): 3
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Pricing (USD)

Qty. Unit Price Ext. Price
2,087 $29.610 $61,796.070

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