NXP Semiconductors - MCIMX503EVM8B

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MCIMX503EVM8B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX503EVM8B
Description SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX503EVM8B Datasheet
In Stock3,054
NAME DESCRIPTION
Minimum Supply Voltage: 1.175 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SYSTEM ON CHIP
Nominal Supply Voltage: 1.225 V
Maximum Supply Voltage: 1.275 V
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Minimum Operating Temperature: -20 Cel
No. of Terminals: 400
Package Equivalence Code: BGA400,20X20,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Length: 17 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B400
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: LFBGA
Width: 17 mm
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Moisture Sensitivity Level (MSL): 3
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