NXP Semiconductors - MCIMX6L2EVN10AC

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MCIMX6L2EVN10AC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6L2EVN10AC
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: TFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
Datasheet MCIMX6L2EVN10AC Datasheet
In Stock3,596
NAME DESCRIPTION
Minimum Supply Voltage: 1.375 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Supply Voltage: 1.5 V
Maximum Seated Height: 1.1 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Length: 13 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Peak Reflow Temperature (C): 260
Package Code: TFBGA
Width: 13 mm
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 3
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