Texas Instruments - X66AK2H06AAAW24

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X66AK2H06AAAW24 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number X66AK2H06AAAW24
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
Datasheet X66AK2H06AAAW24 Datasheet
In Stock295
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Seated Height: 3.75 mm
Surface Mount: YES
No. of Terminals: 1517
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 24
Technology: CMOS
JESD-30 Code: S-PBGA-B1517
Maximum Clock Frequency: 156.25 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 40 mm
Speed: 1400 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.05 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
Minimum Operating Temperature: 0 Cel
Length: 40 mm
Additional Features: ALSO OPERATES AT 1200 GHZ
Terminal Pitch: 1 mm
Temperature Grade: OTHER
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