MCIMX7D3EVK10SC by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCIMX7D3EVK10SC
Description	SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet	MCIMX7D3EVK10SC Datasheet
In Stock	2,778

NAME	DESCRIPTION
Minimum Supply Voltage:	1.045 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.1 V
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	1.1 mm
Surface Mount:	YES
No. of Terminals:	488
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	S-PBGA-B488
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Package Code:	TFBGA
Width:	12 mm
Moisture Sensitivity Level (MSL):	3
Other Names:	568-13662 935316442557 MCIMX7D3EVK10SC-ND
Peripheral IC Type:	SYSTEM ON CHIP
Maximum Supply Voltage:	1.25 V
Minimum Operating Temperature:	-20 Cel
Package Equivalence Code:	BGA488,28X28,16
Length:	12 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.4 mm
Temperature Grade:	OTHER

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,778	-	-

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RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

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