NXP Semiconductors - MCM63Z918TQ8.5R

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MCM63Z918TQ8.5R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCM63Z918TQ8.5R
Description ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Organization: 512KX18;
In Stock192
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 512KX18
Maximum Seated Height: 2.4 mm
Minimum Supply Voltage (Vsup): 3.135 V
Surface Mount: YES
No. of Terminals: 100
No. of Words: 524288 words
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G100
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: QFP
Width: 14 mm
Memory Density: 9437184 bit
Memory IC Type: ZBT SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 18
No. of Functions: 1
Qualification: Not Qualified
Length: 22 mm
Maximum Access Time: 8.5 ns
No. of Words Code: 512K
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: FLOW-THROUGH OR PIPELINED ARCHTECTURE
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.465 V
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