MCM69F819TQ7.5 by NXP Semiconductors | Memory ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCM69F819TQ7.5
Description	CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
Datasheet	MCM69F819TQ7.5 Datasheet
In Stock	3,882

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	256KX18
Maximum Seated Height:	1.6 mm
Minimum Supply Voltage (Vsup):	3.135 V
Surface Mount:	YES
No. of Terminals:	100
No. of Words:	262144 words
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK, LOW PROFILE
Technology:	CMOS
JESD-30 Code:	R-PQFP-G100
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	LQFP
Width:	14 mm
Memory Density:	4718592 bit
Memory IC Type:	CACHE SRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	18
No. of Functions:	1
Length:	20 mm
Maximum Access Time:	7.5 ns
No. of Words Code:	256K
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	FLOW-THROUGH
Parallel or Serial:	PARALLEL
Terminal Pitch:	.65 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,882	-	-

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