NXP Semiconductors - MHW1303LA

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MHW1303LA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MHW1303LA
Description WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Construction: MODULE; Maximum Operating Frequency: 200 MHz; Maximum Supply Current: 110 mA;
Datasheet MHW1303LA Datasheet
In Stock3,948
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Construction: MODULE
Minimum Operating Frequency: 5 MHz
Sub-Category: RF/Microwave Amplifiers
Maximum Supply Current: 110 mA
Minimum Operating Temperature: -20 Cel
No. of Functions: 1
Package Equivalence Code: MOT CASE 1302-01
Technology: HYBRID
Characteristic Impedance: 75 ohm
Maximum Operating Temperature: 100 Cel
Maximum Operating Frequency: 200 MHz
RF or Microwave Device Type: WIDE BAND HIGH POWER
Gain: 30 dB
Power Supplies (V): 24
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