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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MIMX8DL1AVNFZBA |
Description | SoC; Terminal Form: BALL; No. of Terminals: 388; Package Shape: SQUARE; Terminal Position: BOTTOM; Peak Reflow Temperature (C): 260; |
Datasheet | MIMX8DL1AVNFZBA Datasheet |
In Stock | 2,579 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | SoC |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.7 mm |
Surface Mount: | YES |
No. of Terminals: | 388 |
Terminal Position: | BOTTOM |
Length: | 15 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B388 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 260 |
Width: | 15 mm |
Moisture Sensitivity Level (MSL): | 3 |