Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MIMX8DL1AVNFZBA |
| Description | SoC; Terminal Form: BALL; No. of Terminals: 388; Package Shape: SQUARE; Terminal Position: BOTTOM; Peak Reflow Temperature (C): 260; |
| Datasheet | MIMX8DL1AVNFZBA Datasheet |
| In Stock | 2,579 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 568-MIMX8DL1AVNFZBA |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SoC |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.7 mm |
| Surface Mount: | YES |
| No. of Terminals: | 388 |
| Terminal Position: | BOTTOM |
| Length: | 15 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B388 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 260 |
| Width: | 15 mm |
| Moisture Sensitivity Level (MSL): | 3 |









