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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | MPC7410THX400LE |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B; |
Datasheet | MPC7410THX400LE Datasheet |
In Stock | 2,428 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.7 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Integrated Cache: | NO |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 1 |
Speed: | 400 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.9 V |
Low Power Mode: | NO |
Boundary Scan: | NO |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Peak Reflow Temperature (C): | 260 |
Temperature Grade: | INDUSTRIAL |