NXP Semiconductors - MPC7410THX400LE

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MPC7410THX400LE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC7410THX400LE
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B;
Datasheet MPC7410THX400LE Datasheet
In Stock2,428
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: NO
Maximum Time At Peak Reflow Temperature (s): 40
Surface Mount: YES
Terminal Finish: TIN LEAD
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 1
Speed: 400 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.9 V
Low Power Mode: NO
Boundary Scan: NO
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Peak Reflow Temperature (C): 260
Temperature Grade: INDUSTRIAL
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