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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | AM5K2E04XABD4 |
Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | AM5K2E04XABD4 Datasheet |
In Stock | 295 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 3.55 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
On Chip Data RAM Width: | 8 |
No. of Terminals: | 1089 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
No. of DMA Channels: | 5 |
Address Bus Width: | 16 |
Technology: | CMOS |
RAM Words: | 2097152 |
JESD-30 Code: | S-PBGA-B1089 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Width: | 27 mm |
Moisture Sensitivity Level (MSL): | 4 |
Speed: | 1400 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.05 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Length: | 27 mm |
Peak Reflow Temperature (C): | 245 |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |