NXP Semiconductors - MPC8250ACZQIHBC

MPC8250ACZQIHBC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8250ACZQIHBC
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
In Stock1,292
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.55 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 516
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B516
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Speed: 200 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.9 V
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Qualification: Not Qualified
Length: 27 mm
Additional Features: REQUIRES 3.3V SUPPLY FOR I/O
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
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