NXP Semiconductors - MPC8250AVVMHBC

MPC8250AVVMHBC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8250AVVMHBC
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Low Power Mode: NO;
In Stock3,207
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.65 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 480
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B480
Package Shape: SQUARE
Terminal Form: BALL
Package Code: LBGA
Width: 37.5 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR, RISC
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e1
Length: 37.5 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1.27 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
3,207 $1.000 $3,207.000

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