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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MPC8308VMADDA |
| Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 473; Package Shape: SQUARE; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; |
| In Stock | 3,347 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER |
| JESD-609 Code: | e2 |
| No. of Terminals: | 473 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B473 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 260 |
| Moisture Sensitivity Level (MSL): | 3 |









