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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MPC8308VMAFDA |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 473; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: S-PBGA-B473; |
In Stock | 1,346 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER |
JESD-609 Code: | e2 |
No. of Terminals: | 473 |
Qualification: | Not Qualified |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B473 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 260 |
Moisture Sensitivity Level (MSL): | 3 |