NXP Semiconductors - MPC8313VRAFFC

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

The NXP MIMXRT1175AVM8A microprocessor features integrated cache, 32 DMA channels, and a max clock frequency of 48 MHz. Ideal for automotive applications, it operates in a temperature range from -40 to 125°C with low power mode support.

Intel FWIXP420BC is a 32-bit microprocessor with integrated cache, operating at 33.33 MHz. It features a grid array package style and CMOS technology, suitable for commercial-grade applications requiring high-speed processing within a temperature range of 0-70°C.

The Texas Instruments AM5728BABCX microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and automotive electronics.

AT91SAM9G45-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 50 MHz, 37 DMA channels, and operates in low power mode. This processor is commonly used in applications requiring high-speed processing and low power consumption.

ADSP-21488KSWZ-4B1 by Analog Devices is a 40-bit microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at a max clock frequency of 25 MHz, making it suitable for applications requiring high-speed processing in commercial temperature environments. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE;

MICROPROCESSOR; Technology: CMOS;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Technology: CMOS; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;

The NXP Semiconductors MCF54416CMJ250 is a 32-bit microprocessor with integrated cache and a max clock frequency of 100 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

14305R-2000 by Dialog Semiconductor is a Microprocessor with 48 terminals, operating at 3.3V nominal voltage and up to 10 MHz clock frequency. Ideal for industrial applications requiring CMOS technology, it features a compact square package style with boundary scan capability.

Microprocessors;

The NXP Semiconductors MPC8347VVAJFB is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and low profile, this processor is ideal for space-constrained designs where power efficiency is crucial.

STM32MP135CAG3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words, 48 MHz clock frequency, and 56 DMA channels. It is used in applications requiring a RISC peripheral IC with low power mode, such as IoT devices and embedded systems.

The NXP Semiconductors LX2160XC72232B microprocessor features a 64-bit architecture with 128 external data bus width and integrated cache. It is designed for industrial applications, offering low power mode and operating temperature range from -40 to 105°C. With 1517 terminals in a grid array package style, it supports boundary scan and RISC technology for efficient performance.

XAM3517AZER by Texas Instruments is a microprocessor with integrated cache and a max clock frequency of 26 MHz. It has a package style of grid array with heat sink, making it suitable for applications requiring high performance and low power consumption.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;