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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MPC8378EVRALD |
Description | MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG; |
Datasheet | MPC8378EVRALD Datasheet |
In Stock | 4,877 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 2.46 mm |
Surface Mount: | YES |
No. of Terminals: | 689 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B689 |
Maximum Clock Frequency: | 66.66 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | HBGA |
Width: | 31 mm |
Speed: | 667 rpm |
Peripheral IC Type: | MICROPROCESSOR |
Maximum Supply Voltage: | 1.05 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
Bit Size: | 32 |
Length: | 31 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1 mm |