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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MPC8533EVJALFA |
| Description | MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 783; Package Code: HBGA; Package Shape: SQUARE; Length: 29 mm; |
| Datasheet | MPC8533EVJALFA Datasheet |
| In Stock | 3,073 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .95 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 2.8 mm |
| Surface Mount: | YES |
| No. of Terminals: | 783 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Address Bus Width: | 16 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B783 |
| Maximum Clock Frequency: | 133 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | HBGA |
| Width: | 29 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 667 rpm |
| Peripheral IC Type: | MICROPROCESSOR |
| Maximum Supply Voltage: | 1.05 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 64 |
| Bit Size: | 32 |
| Length: | 29 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1 mm |
