NXP Semiconductors - MPC8541EPXALF

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MPC8541EPXALF by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8541EPXALF
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: HBGA; Package Shape: RECTANGULAR;
In Stock3,221
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.75 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 783
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 64
Technology: CMOS
JESD-30 Code: R-PBGA-B783
Maximum Clock Frequency: 166 MHz
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: HBGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 3
Speed: 667 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.26 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Length: 29 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
3,221 $0.003 $9.663

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