NXP Semiconductors - MPC8548CVJAQGD

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MPC8548CVJAQGD by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8548CVJAQGD
Description SoC; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
In Stock2,320
NAME DESCRIPTION
Minimum Supply Voltage: 1.045 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.1 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 3.38 mm
Sub-Category: Microprocessors
Surface Mount: YES
No. of Terminals: 783
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B783
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.155 V
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA783,28X28,40
Length: 29 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Power Supplies (V): 1.1,1.8/2.5,2.5/3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
2,320 $238.200 $552,624.000

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