NXP Semiconductors - MPC860TZP33

MPC860TZP33 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC860TZP33
Description MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE;
Datasheet MPC860TZP33 Datasheet
In Stock2,024
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Integrated Cache: YES
Maximum Seated Height: 2.52 mm
Surface Mount: YES
No. of Terminals: 357
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
No. of DMA Channels: 16
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B357
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 25 mm
Speed: 33 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
No. of External Interrupts: 7
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA357,19X19,50
Length: 25 mm
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
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