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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | MSC8103M1200F |
Description | DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 332; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | MSC8103M1200F Datasheet |
In Stock | 3,379 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.55 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.6 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 3.18 mm |
Sub-Category: | Digital Signal Processors |
Surface Mount: | YES |
Terminal Finish: | Tin/Lead/Silver (Sn/Pb/Ag) |
No. of Terminals: | 332 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Address Bus Width: | 32 |
Technology: | CMOS |
RAM Words: | 262144 |
JESD-30 Code: | S-PBGA-B332 |
Maximum Clock Frequency: | 75 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 75 Cel |
Package Code: | FBGA |
Width: | 17 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
Maximum Supply Voltage: | 1.7 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
Bit Size: | 16 |
Barrel Shifter: | NO |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Internal Bus Architecture: | MULTIPLE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA332,19X19,32 |
Length: | 17 mm |
Peak Reflow Temperature (C): | 220 |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 1.6,3.3 |