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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MSC8144ETVT800A |
| Description | DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES; |
| Datasheet | MSC8144ETVT800A Datasheet |
| In Stock | 580 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .97 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 3.176 mm |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver (Sn/Ag) |
| No. of Terminals: | 783 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B783 |
| Maximum Clock Frequency: | 133 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Width: | 29 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
| Maximum Supply Voltage: | 1.05 V |
| Low Power Mode: | NO |
| Boundary Scan: | YES |
| Barrel Shifter: | NO |
| JESD-609 Code: | e2 |
| Internal Bus Architecture: | MULTIPLE |
| Qualification: | Not Qualified |
| Length: | 29 mm |
| Peak Reflow Temperature (C): | 245 |
| Terminal Pitch: | 1 mm |









