
Image shown is a representation only.
Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | MSCMMX6DZDK08AB |
Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 500; Package Code: FBGA; Package Shape: RECTANGULAR; |
Datasheet | MSCMMX6DZDK08AB Datasheet |
In Stock | 4,958 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Maximum Seated Height: | 1.8 mm |
Surface Mount: | YES |
No. of Terminals: | 500 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B500 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Width: | 14 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 800 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 0 |
Minimum Operating Temperature: | 0 Cel |
Length: | 17 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .65 mm |
Temperature Grade: | OTHER |