NXP Semiconductors - P1025NXE5DFB

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P1025NXE5DFB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number P1025NXE5DFB
Description SoC; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
Datasheet P1025NXE5DFB Datasheet
In Stock1,055
NAME DESCRIPTION
Other Names: 935310403557
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Maximum Seated Height: 2.3 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 561
Package Equivalence Code: BGA561,27X27,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Length: 23 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B561
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 23 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 3
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