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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | PHK12NQ03LT,518 |
| Description | N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.5 W; JESD-609 Code: e4; Avalanche Energy Rating (EAS): 440 mJ; |
| Datasheet | PHK12NQ03LT,518 Datasheet |
| In Stock | 2,434 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Configuration: | SINGLE WITH BUILT-IN DIODE |
| Transistor Element Material: | SILICON |
| Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
| Transistor Application: | SWITCHING |
| Maximum Drain Current (ID): | 11.8 A |
| Maximum Pulsed Drain Current (IDM): | 35.3 A |
| Sub-Category: | FET General Purpose Power |
| Surface Mount: | YES |
| Terminal Finish: | Nickel/Palladium/Gold (Ni/Pd/Au) |
| No. of Terminals: | 8 |
| Maximum Power Dissipation (Abs): | 2.5 W |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| JESD-30 Code: | R-PDSO-G8 |
| No. of Elements: | 1 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | ENHANCEMENT MODE |
| Maximum Operating Temperature: | 150 Cel |
| Maximum Drain-Source On Resistance: | .0105 ohm |
| Moisture Sensitivity Level (MSL): | 2 |
| Avalanche Energy Rating (EAS): | 440 mJ |
| JEDEC-95 Code: | MS-012AA |
| Polarity or Channel Type: | N-CHANNEL |
| JESD-609 Code: | e4 |
| Minimum DS Breakdown Voltage: | 30 V |
| Qualification: | Not Qualified |
| Maximum Drain Current (Abs) (ID): | 12 A |
| Peak Reflow Temperature (C): | 260 |
