NXP Semiconductors - S82S191BF3/883B

S82S191BF3/883B by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number S82S191BF3/883B
Description OTP ROM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
Datasheet S82S191BF3/883B Datasheet
In Stock4,377
NAME DESCRIPTION
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Organization: 2KX8
Output Characteristics: 3-STATE
Minimum Supply Voltage (Vsup): 4.75 V
Surface Mount: NO
Maximum Supply Current: 110 mA
Terminal Finish: TIN LEAD
No. of Terminals: 24
No. of Words: 2048 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-CDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 75 Cel
Package Code: DIP
Input/Output Type: COMMON
Memory Density: 16384 bit
Memory IC Type: OTP ROM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Maximum Access Time: 35 ns
No. of Words Code: 2K
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Temperature Grade: COMMERCIAL EXTENDED
Maximum Supply Voltage (Vsup): 5.25 V
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
4,377 - -

Popular Products

Category Top Products