NXP Semiconductors - S9S08RN8W2MLF

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S9S08RN8W2MLF by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number S9S08RN8W2MLF
Description MICROPROCESSOR; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
In Stock4,807
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Integrated Cache: NO
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Maximum Supply Current: 14 mA
Terminal Finish: TIN
On Chip Data RAM Width: 8
No. of Terminals: 48
No. of Serial I/Os: 2
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Address Bus Width: 0
Technology: CMOS
RAM Words: 2048
JESD-30 Code: S-PQFP-G48
Maximum Clock Frequency: 20 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: LFQFP
Width: 7 mm
Moisture Sensitivity Level (MSL): 3
Speed: 20 rpm
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 5.5 V
No. of External Interrupts: 8
Low Power Mode: YES
Boundary Scan: NO
External Data Bus Width: 0
Bit Size: 8
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: QFP48,.35SQ,20
Length: 7 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
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