NXP Semiconductors - SCIMX6Q5EYM10CC

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SCIMX6Q5EYM10CC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SCIMX6Q5EYM10CC
Description MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
Datasheet SCIMX6Q5EYM10CC Datasheet
In Stock4,793
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.6 mm
Sub-Category: Graphics Processors
Surface Mount: YES
Maximum Supply Current: 3920 mA
No. of Terminals: 624
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Maximum Clock Frequency: 24 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: HBGA
Width: 21 mm
Speed: 1000 rpm
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 1.5 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 64
Qualification: Not Qualified
Package Equivalence Code: BGA624,25X25,32
Length: 21 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Power Supplies (V): 1.05/1.5
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