NXP Semiconductors - SL2S2602FUD/BG

SL2S2602FUD/BG by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SL2S2602FUD/BG
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Functions: 1;
Datasheet SL2S2602FUD/BG Datasheet
In Stock4,302
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Telecom IC Type: TELECOM CIRCUIT
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: CMOS
JESD-30 Code: X-XUUC-N
Package Shape: UNSPECIFIED
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Package Code: DIE
Temperature Grade: INDUSTRIAL
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